Wirenet Image Band
wirenet.org mobile image band

Wire Journal News

WAI repeats its Call for Papers for both Mexico and Italian tech conferences

WAI is reaching out again to technical paper authors to take part in two Association efforts this year in Italy and Mexico.
The timing is tight for Wire & Cable Milan 2023, which will be held Oct. 16, 2023, at the Palazzo Giureconsulti in Milan, Italy. For Milan, the abstract deadline is Feb. 28. If that date is a concern, authors can contact WAI staff for a possible extension. Acceptance notifications will be sent March 31, and the manuscript deadline is July 31.
The event is being put on with ACIMAF, the Italian wire machinery association, led by President Ferruccio Bellina, a long-time supporter of such efforts. WAI last held an event in Italy in Verona in 2019, with other events there in Milan (2013), Bologna (2007) and Stresa (2003).
The timing is better for WAI’s Mexico ITC, which will be held Nov. 13-15, 2023, at the Crowne Plaza Hotel, in Monterrey, Mexico. It was last held at the same location in 2016, at which time it drew 190 participants. The WAI had held two prior ITCs in Monterrey (2008 and 2010), and one in Querétaro (2004). At all those events, WAI Past President Antonio Ayala served as a key volunteer and organizer.
For both events, the Association is seeking presentations on technical subjects, but also on topics such as sustainability, workforce issues, operating best practices or general business influences in the wire and cable industry.
For Monterey, the abstract deadlines is April 17. Notification will be made by May 22, and the manuscript deadline is Oct. 1. The program will include a presentation about market conditions in Mexico, Central America and South America

Read 1206 times Last modified on March 5, 2023

Contact us

The Wire Association Int.

71 Bradley Road, Suite 9

Madison, CT 06443-2662

P: (203) 453-2777